Packaging form: Mini package 0.5gProduct color: whiteConductivity: ROCT8.140-82 0.95Thermal impedance: ASTM D5470 0.219Specific gravity: ASTM D1475 2Evaporation: Fed.Std.791 0.001Oil seepage: Fed.Std.791 0.05Insulation constant: ASTM D150 5.1Dissipation coefficient: ASTM D150 0.005Viscosity value: GB/T-10247 59Cone penetration: GB/T-269 38010Temperature range: -50~180 Scope of application: CPU/GPU and other heat dissipation components gap filling heat conduction, mini bag is easy to use.This product has high thermal conductivity, high insulation, high temperature resistance, will not dry out after long-term exposure, is not easy to volatilize, is non-toxic, odorless, and non-corrosive.Compared with other heat dissipation glue containing silver materials, which are hard and inconvenient to apply, I personally still like this liquid material, which is easy to apply. If you really can't find something, just take a piece of paper and fold it 1-2 times. It's simple and easy.Many buyers think that the more heat dissipation silicone is applied, the better. In fact, it is not. As long as it is evenly covered on the CPU or GPU, a thin layer is enough. It is well applied if you can't see the CPU or GPU below. Too thick or too thin will affect heat dissipation.