AXP120-X67 Fan Cooler 67mm Thin Pure Copper Push Down CPU Cooler Suitable For ITX Small A4 Case For LGA1700 115X 1200 2011 AM4 Product parameters product code& 65306;BG685K Radiator size: L123.5mm * W 120mm * H 52mm Radiator material: aluminum fins + pure copper heat pipe with nickel plating Product weight: 490g Tight matching process: reflow soldering copper bottom through FIN Supported platforms: Intel: LGA 115X/1200/1700/2011/2066 AMD: AM4 Fan size: L 120mm * W 120mm* H 15mm Fan weight: 120g Fan speed: 1800 RPM±10% Fan noise: ≤26.1 dBA Fan air volume: 59 CFM Fan pressure: 1.36mm/H:O(MAX) Fan interface: 4PIN PWM Working voltage: 12V DC Product Description *According to the characteristics of instantaneous CPU heating power consumption, high peak value, and low standby limit, the single heat pipe of the module is independently adjusted on the basis of the AGHP heat pipe. The use of different heat pipe power ratios makes the overall heat dissipation power consumption of the radiator form a wide range of heat dissipation and greatly increases the upper limit of heat dissipation *AGHP technology: Vertical radiator is a common chassis installation method, adopting Use the new heat pipe process to solve the problem of slow performance of thermal capillary reflow affected by gravity. Enables radiator performance in vertical orientation to optimize performance *The TPC data of heat dissipation power consumption of the radiator comes from the thermal power heating platform, which is not related to the nominal TDP of the CPU. The actual heat dissipation rate varies with the platform, and the actual measurement shall prevail. *AGHP GEN3: Further optimization on the AGHP technology, based on different module structures and heat source center points, the upper limit of the power of a single heat pipe position is set differently