1. Excellent capacity of solder-stickiness 2. Excellent Anti-wet Capacity 3. Widely used on BGA, , CSP packages and Flip Chip Operation 4. Suitable for multiple PCB Reflow 5. No-clean and Lead free for Applicable to value ball, generally used for North-South bridge, mobile phone chip, CPU Socket value ball. For large-area hand-painted value balls (referring to chips), they need to be cleaned. It is used for lattice value ball (such as CPU Socket on computer motherboard). The residue after soldering is transparent, the solder ball is bright, and it does not contain halogen(F / / Br / I) substances. The paste has a moderate viscosity and a fine particle size, generally 2-5 m. Suitable for hand brushes, Machine automatic printing and other processes. It can be applied to both reflow soldering and manual value ball processes. Clear and very clean SUITABLE:Multiple PCB Reflow FEATURE:No-clean and Lead Free Tips:The product may be updated constantly, The Actual Product May Have Slight Differences Or Color Differences the color and appearance may be changed, please don't mind. And take a consideration before place the order if you have request for color or appearance. Colour:As Shown Material:Plastic Package Contents: 2 * flux paste 2 * push rods 4 * heads Only the above package content, other products are not included. Note: Light reflection and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.